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Teledyne Micralyne Micralyne MicraGEM-Si™ MEMS Process

Description

Micralyne MicraGEM-Si^TM is a silicon-on-insulator (SOI) based MEMS process which will reduce the initial cost and risk of prototype development, while speeding the time to market for MEMS- Based devices.

MicraGEM-Si^TM is ideally suited for the manufacture of tilting mirrors and mirror arrays for variable optical attenuators (VOA) and wavelength selective switch (WSS) modules, commonly used in fiber optic telecom networks as well as resonators, inertial and bio sensors.

Note: The expected number of chips to be delivered for this technology is 15.

Applications

Display technology
Optics and telecommunications
Inertial sensing
Biomedical and environmental sensing

Sevices

Design kits
Documentation including design handbooks
Datasheets can be ordered from http://www.micralyne.com/data-sheets/
Design rule checking services
CMC engineering support
Access community-based support and collaborations
Design consultation*
Packaging & assembly services*

* Additional charges apply.

Features

Two thick SOI structure layers with up to three functional levels of silicon thickness option. This enables structures such as vertical comb-drive actuators.
Base and top device layers are electrically connected through the bond interface, allowing 3D routing of electrical signals.
Patterned low-stress gold metallization on the top surface is suited for highly reflective mirrors and contact pads for gold wire bonding.
Design size 4 mm x 4 mm
SOI MEMS
Two structure layers
Three trench depths

Design Kits and Libraries

Pricing

List Price

Price for Subscribers

Dedicated runs only. Contact fab@cmc.ca.

Licensing

Contact licensing@cmc.ca.

Minimum Access Requirement

For Canadian Academics

To Access

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