FAB

MEMSCAP Post-Processing for PolyMUMPs

Description

In partnership with MEMSCAP Inc., CMC offers users access to the PolyMUMPs technology.PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post-processing for PolyMUMPS offers optional HF release and supercritical carbon dioxide drying.

This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.

For more information contact fab@cmc.ca.

Features

Optional HF release and supercritical carbon dioxide drying.
Allows users to develop acoustics, motion sensors, optical MEMS, etc.

Design Kits and Libraries

Pricing

List Price

Price for Subscribers

$3,301/mm²
(Minimum charge is for a 4.75 x 4.75 mm² design)

Click for Subscriber Pricing

Note: List pricing is in US funds and does not include engineering support. Contact fab@cmc.ca for a quote.

Note: Discounted pricing is available to academics in Canada with a CMC Subscription. You must sign in to see it.

Licensing

Help with Licensing
Contact licensing@cmc.ca

Minimum Access Requirement

For Canadian Academics

To Apply

FAB Support

Does your research benefit from products and services provided by CMC Microsystems?

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