Overview
LTCC technology is a general-purpose multi-layer ceramic process used in various areas, namely:
- Medical sensors and electronics
- Automotive electronics
- Satellite electronics and other vehicles in harsh environments
- RF/microwave/mm-wave communications
CMC provides access to LTCC prototyping and other related services through the LTCC@ÉTS laboratory, including technical support on the LTCC process and access to the design kit.
Applications
LTCC can be used in a wide range of applications including, but not limited to, the following:
- Ceramic packaging
- Compact lumped components (RLC)
- Low-loss RF, microwave and mm-wave circuits
- Printed and dielectric resonator antennas
- Thermal management through metallized thermal vias
- Ceramic interposers for multi-chip module integration
- High-speed interconnects for wire-bondable or flip-chip assembled components
Related Services
Additional services available at the LTCC@ETS laboratory include:
- Die Mounting and wire bonding, gold balling and flip chip ultrasonic attach
- DRC and engineering support for LTCC design
- X-ray internal structure inspection
- Electrical characterization using network and spectrum analyzers