CMC offers access to the GlobalFoundries® 12 nm FinFET technology. The 12LP technology is targeted for high-performance, power-efficient SoC applications in demanding, high-volume applications. 3D FinFET transistor technology provides best-in-class performance and power with significant cost advantages from 12nm area scaling. FinFET benefits include high drive current and soft error rate reduction vs planar technology. FinFET improves Subthreshold Swing/Slope (SS) vs the planar FET, thanks to the better electrostatic control over the channel. For the same reason, FinFET has lower Body Effect, higher output impedance, and higher intrinsic gain.
CMC also offers access to 12LP+ technology, which consumes 20% less power and delivers 15% higher performance than 12LP.
CMC Microsystems offers access to GlobalFoundries technologies via its cost-shared multi-project wafer runs. To access this technology, please contact [email protected].
For more information, visit Global Foundries at: FinFET 12LP+ | GlobalFoundries.
The metal stacks and features supported by CMC for dedicated runs are:
- 13 metal layers
- 11 metal layers
- 10 metal layers
- 9 metal layers
- MIMCAP
- MRARM
Applications
Potential applications include:
- high-performance, power-efficient SoC applications such as CPU/ GPU and mobile processors
- Wired and wireless networking
- RF/Analog: Wi-Fi, transceivers and high-speed networking
- Low power applications
- Radiation-tolerant applications