Overview
These carriers are designed primarily for DC characterization. However, the layouts include 50-ohm co-planar GSG bias lines with 500-micron pitch. The laser carrier includes provision for inclusion of wire bonds to power up to six independent sections and accommodates a device with up to a 3 mm cavity length. The waveguide device is shorter, to allow optical fibre access to both input and output facets of a device with a 3 mm cavity length.
Applications
- Photonic chip-on-carrier applications
- Semiconductor laser testing
- Optical waveguide device testing
Pricing
Contact sales@cmc.ca for a quote.