Search
CMC logo English
Subscribe

FAB

FABrIC Logo white

Flip-Chip Assembly Services

Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing competitive pricing, access to quick-start documentation, and engineering support.

GaN die flip-chip assembled on ceramic substrate – a compact RF module.

Pricing

Contact sales@cmc.ca for a quote.

Helpful Resources

Overview

CMC provides access to solder bump and gold stud bump flip-chip services through QP Technologies  and 3IT.Micro. Support for different solder alloys, such as tin-lead and gold-tin, is available.

Chip-to-PCB solder-based assembly is offered through the 3IT.Micro lab at the Université de Sherbrooke.

Applications

  • High-speed and RF devices and packaging
  • Small footprint prototypes

Access and Support

  • We recommend that researchers who wish to use flip-chip services through CMC contact our engineers during the design phase to obtain advice  regarding flip-chip layout requirements.
  • For engineering support and to request access, contact fab@cmc.ca.

Stay Informed

     

Acknowledge CMC Support | Policies | Terms and Conditions | Help with Accessibility

Twitter Facebook-f Youtube Instagram Linkedin-in

©2024 CMC Microsystems. All Rights Reserved.​

CMC Microsystems, the CMC Microsystems logo, CMC Basecamp, CMC SponsorChip, CADpass, Canada’s National Design Network and Réseau National de Conception du Canada are trademarks or registered trademarks of Canadian Microelectronics Corporation / Société canadienne de micro-électronique operating as CMC Microsystems.
Scroll to Top
Skip to content