Aaron Wang

AMS 0.35 µm CMOS Process Technology (Basic)

This 0.35 μm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic (see details below), Opto and High-Voltage. Basic Process (C35B4C3) Details Technology Features: 4 metal and 2 poly layers Supply Voltage: 3.3/5V Bulk-micromachining option, allowing […]

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TSMC 0.35 µm CMOS Process Technology

This 0.35 μm CMOS technology is available through CMC’s multi-project wafer service, which delivers Taiwan Semiconductor Manufacturing Company (TSMC) nanometer and micron-scale CMOS technologies. Applications The 0.35 µm CMOS (CMC term is CMOSP35) process is suitable for: Analog circuits RF circuits Mixed-signal circuits Process Details Electrical Contact Forming Technology: Polycide Layers: 4 metal, 2 poly Supply Voltages:

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Synopsys Design Tools

Synopsys provides a comprehensive portfolio of tools for silicon design, synthesis and verification. Software tools available in this bundle include: Custom Design Digital Design Silicon Lifecycle Management Verification For more information, see the Synopsys University Program. For more information about the software available for the current year, contact us at cad@cmc.ca. Licensing Requirements or Restrictions Technical

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SolidWorks Software Packages

SolidWorks Software Packages cover 2D and 3D part modelling, large assembly design, sheet metal and weldments, surfacing, molds, product configuration, and 3D rendering and design analysis for manufacturing and computer-aided manufacturing (CAM). For a full list of the SolidWorks tools available in this package, please refer to the SolidWorks Quick Start Guide. We offer Standard and

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Building for the future: YetiWare takes on the heterogeneous computing challenge

The function of computers depends on a myriad of intricate interactions between the hardware and software inside the machine. As computers become faster, more powerful and increasingly sophisticated, so too does the complexity of those hardware-software “conversations” – and that poses a significant problem for computer engineers.

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photo of Malcolm Eade, Spectra CEO; Graham Gibson, Hannah Dies, Aris Docoslis and Josh Raveendran.

Nano research yields sensing breakthrough

Nanofabrication capabilities helped Queen’s University researchers and their graduate students develop a novel, highly sensitive portable biosensor that can be manufactured simply and inexpensively. Their technology now forms the basis of an award-winning startup company, Spectra Plasmonics. Shown left to right: Malcolm Eade, Spectra CEO; Graham Gibson, Hannah Dies, Aris Docoslis and Josh Raveendran.

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Global conference recognizes made-in-Canada photonics innovations

Joyce Poon, Sorin Voinigescu and their teams solved a significant problem in short-distance optical communications with their development of a 3-D integrated transmitter using a CMOS driver. Their novel solution combines the advantages of high performance and low power consumption with low-cost, established manufacturing processes.

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New direction for a dependable dish

Neil Roy Choudhury and Hamid Sadabadi, Concordia University graduates, leveraged their mutual expertise and interest in microfluidics and biosensing to create their Calgary-based startup, Frontier Fluidics. Experience using advanced design tools and industrial manufacturing processes is enabling them to create next-generation labs-on-a-chip that mimic real-world environments, customized for innovators doing a broad range of research and experimentation.

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Novel transceiver paves the way for a battery-less future

A fresh approach to wireless transceiver design has helped École de technologie supérieure professors Frederic Nabki (bottom right) and Dominic Deslandes (bottom centre) develop a new technology with dramatically lower energy requirements, offering potential for devices that never need recharging Their chip is now being commercialized by their startup company, SPARK Microsystems. Other team members, from left to right include Rabia Rassil, Antoine Collerette, Gabriel Morin-Laporte and Michiel Soer.

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Western University’s Jun Yang (left) and Patrick Therrien (right), showing award and a bottle of Formicast Resin

Formi 3DP: Spawning the ‘stem cells’ for circuitry

Western University’s Jun Yang (left) uses surface chemistry to modify and add functionality to materials through initiator-integrated 3D printing (i3DP). Formi 3DP, his startup company co-founded with assistance from Patrick Therrien (right), uses this novel, low-cost process to develop polymer “stem cells” capable of creating 3-D objects with user-defined properties, and holds promise for the efficient production of complex electronic circuitry.

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Dr. Boris Stoeber with company co-founder Iman Mansoor and Dr. Mehrsa Raeiszadeh, a Microdermics employee, demonstrating less invasive blood sampling.

Taking the sting out of injections

Dr. Boris Stoeber (right), professor at University of British Columbia, is redefining drug delivery through the
development of painless, hollow metal microneedle arrays that barely penetrate the skin. More recently,
he and his team have integrated optical sensing properties into these arrays, offering a faster, cheaper and
less invasive alternative to hypodermic-based blood sampling for drug monitoring. Founder of microneedle
startup Microdermics, he is shown here with company co-founder Iman Mansoor (centre) and Dr. Mehrsa
Raeiszadeh (left), Microdermics employee.

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Photo of Rashid Rashidzadeh, adjunct professor at University of Windsor, and his students

Measuring success by the micrometre: Industry-university collaboration helps automotive companies innovate

Rashid Rashidzadeh, adjunct professor at University of Windsor, and his students helped Canadian automotive supplier Landau Gage address a key productivity barrier for parts manufacturers while developing highly skilled innovators for the advanced technology manufacturing sector

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Photo of Dr. Leonid Belostotski working in a lab

Novel receivers target world’s largest radio telescope

Dr. Leonid Belostotski’s pioneering development of focal plane arrays with low-noise receivers is solving a
major problem in cosmic research while creating novel technologies with broad commercial potential. The
University of Calgary researcher’s work is part of a global effort to build the world’s largest radio telescope
for transformational research into the evolution of our universe.

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Photo of Ghazal Nabovati, PhD candidate and others

Thinking outside the chip: Researcher’s smart petri dish solves biosensor challenge

Ghazal Nabovati (centre right), PhD candidate at Polytechnique Montréal’s Polystim Neurotechnology Lab, successfully integrated biology, chip design, electronics, software and mechanical prototyping to develop a novel cell imaging platform that makes cell analysis simple, fast and automatic.

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Photo of Sudip Shekhar holding a chip being viewed through a microscope

Integrated R&D community attracts innovative chip designer to Canada

The opportunity to nurture new talent and share technology innovation via Canada’s National Design Network proved irresistible to industrial research scientist Sudip Shekhar. Now assistant professor in electrical and computer engineering at University of British Columbia, the former Intel employee left the U.S. to pursue research innovation in silicon photonics while mentoring students in this emerging field.

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