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Mini-Circuits Wideband Amplifier 0.1 to 18 GHz

Equipment Loan / By

Features Multiple, independent channels per radio and multiple radios per Access Point that deliver exceptional throughput advantages over convention Access Points 162 Mbps per radio – basic (3-channel) configuration provides over 50x increased throughput performance versus single-channel access points Uses industry-leading, proprietary data converter technology Roving Monitor that acts as a sniffer looking for rogue […]

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Other Ways to Run HPC (High-Performance Compute) Simulations

Support Document / By

Some subscribers are interested in running large-scale CAD (Computer Aided Design) simulations and have booked time on Digital Research Alliance of Canada (“The Alliance”) nodes in which they install or use existing CAD installations. They want to connect their software and nodes to a CMC licence server and run simulations. To set up a secure

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Edgewater Wireless EAP3031 Spectrum Slicing Access Point

Equipment Loan / By

Features Multiple, independent channels per radio and multiple radios per Access Point that deliver exceptional throughput advantages over convention Access Points 162 Mbps per radio – basic (3-channel) configuration provides over 50x increased throughput performance versus single-channel access points Uses industry-leading, proprietary data converter technology Roving Monitor that acts as a sniffer looking for rogue

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Research Workshop – Secure IoT Hardware

Events / By

Description While the Internet of Things (IoT) promises billions of connected sensing devices collecting, processing, and communicating unprecedented amounts of data, each device represents a potential access point for security breaches that expose personal information or cause harm to human life or essential infrastructure. Through presentations and open discussion, this 1/2-day virtual workshop will bring

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Accelerating AI Workshop 2022 – Challenges and Opportunities in Cloud and Edge Computing

Events / By

Description CMC Microsystems is pleased to organize the third workshop on accelerating AI, highlighting the challenges and opportunities of AI acceleration from the cloud to the edge. This workshop aims to bring together experts from industry and academia to share their latest achievements and innovations in the field of AI and machine learning algorithms, software,

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QSciTech-QuantumBC Virtual Workshop 2022: Quantum Machine Learning with Gate-Based Quantum Computing Using IBM Quantum

Events / By

Quantum computing has the potential to solve problems beyond the capabilities of conventional supercomputers, and could revolutionize the advancement of several fields, including materials science, biochemistry, finance, logistics, and artificial intelligence. It is thus essential to develop concrete expertise to take advantage of the new possibilities that will arise from quantum computing.  In 2020, the

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Xilinx Versal AI Core Series VCK190 Evaluation Kit

Dev Systems, Equipment Loan / By

What’s Included Xilinx VCK190 Evaluation Board QSPI Book Module Pmod Module 2x Ethernet Cables 2x Micro SD cards 180W (12V) power supply Resources Quick Start Guide, Targeted Reference Designs, PetaLinux Board Support Package and more are available at the Xilinx VCK190 Product Webpage System Controller Image & Beam Tool Applications The VCK190 Evaluation Kit is

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BARVINN: A Barrel RISC-V Neural Network Accelerator

Dev Systems / By

Features Complete design and verification environment Access to the FPGA based emulation Easy integration with TensorFlow and Pytorch Applications Low power AI at the edge Hardware Software exploration Machine learning accelerator on FPGA Presentation Accelerating AI 2021 – Challenges and Opportunities in Cloud and Edge Computing Resources BARVINN Source Code BARVINN: Barrel RISC-V Neural Network

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Atlas 200 DK AI Developer Kit

Dev Systems, Equipment Loan / By

AI-oriented heterogeneous computing architecture provides hierarchical APIs to help you quickly build AI applications and services based on the Ascend platform. Features High integration Powered by the Huawei Ascend 310 AI processor, and integrates various peripheral interfaces and the Mind Studio, facilitating access to the development environment and enabling quick development Easy-to-use software environment Mind

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thinkRF R5500-427 27GHz Real Time Spectrum Analyzer

Equipment Loan / By

System Overview Sampling at 125 MS/s with a selectable IBW up to 100MHz, the R5500 RTSA performs with excellent dynamic range, phase noise performance and speed. The CMC system is comprised of the R5500 RTSA, test antennas and a laptop containing the thinkRF application & integration software in a portable hard-shell carrying case. Keysight’s 89601C

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Calibre Manufacturing Tools Available to Clients (RET, MDP and FRACTURE tools)

Support Document / By

Siemens’ Calibre CAD suite incorporates a number of diverse tools for mitigating and predicting manufacturing imperfections generated during the fabrication of optical and electronic components. This overview page is meant to give a brief introduction to the stages through which each design must pass from circuit schematic to finished, physical semiconductor chip, and the roles

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Synopsys TCAD Sentaurus Training Modules on the CMC STC Disk

Support Document / By

We sometimes receive requests to provide training and examples for the TCAD Sentaurus CAD suite. The table below lists most of the introductory training modules for this suite. They are designed specifically for new users, and provide follow-along examples and exercises. Not all modules are listed here. For the complete list, and to run the tutorials,

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Presentations from “Configure Your Research Platform: Infrastructure Needs for Embedded and Heterogeneous Computing”

Support Document / By

During March and April 2018, CMC organized several one-day interactive seminars to explore research infrastructure requirements for heterogeneous computing implementations from small, low power sensor nodes, to network edge devices to the cloud. Specific infrastructure topics included needs and specifications for tools and platforms for: Application-Specific Instruction Set Processors (ASIPs) and hardware accelerators Open-source processor

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Siemens’ Pyxis, Calibre Interactive and Questa ADMS: Version Compatibility

Support Document / By

The following is cobbled together from the release notes of these Siemens’ CAD tools. Note that after Calibre release 2013.3_*, two operating system streams were made available to users. For Red Hat Enterprise 5 users, files with ‘ixl’ in their names are required. For Red Hat Enterprise 6 and SUSE 11 users, files with ‘aoi’

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How to convert dual-boot HP Z400 Workstation to Windows 7 only

Support Document / By

Below are instructions to convert the dual-boot HP Z400 workstation (shipped in Fall 2012 for use with the Xilinx ML605, Altera DE4-530 and BEE3 FPGA boards) into a Windows 7 only configuration. This provides the benefit of additional hard disk space (2x 1TB drivers), which is currently half-occupied by the Linux partition. Use the following

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Setup Information for the HP Z400 workstations (ML605, DE4-530, BEE3)

Support Document / By

Below are some facts/tips to setup and start using the HP Z400 workstations which are being delivered for use with several FPGA development systems (Xilinx ML605, Altera DE4-530, BEEcube BEE3). We will add details as queries arise, but feel free also to comment on this document to ask any specific questions. The workstations are dual

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Using CMC Cloud Design Environment – Windows

Support Document / By

Table of Contents Introduction CMC cloud design environments are virtual on-demand secure design environments. These environments include CAD tool suites and can host Process Design Kits (PDKs). This document guide you to use CMC cloud where you can perform your research. Accessing CMC cloud Access to CMC cloud is included with many of the CAD Tools available

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How to SFTP with CMC to Upload a Video for Symposium

Support Document / By

End user upload and download file instruction Windows user: To connect to SFTP server from a Windows system, the user must use a SFTP client software. i.e. FileZilla, MobaXterm, WinScp, etc. This is free software that you can download from the Internet. Host: sftp://cmc-fab-01.cmc.ca (make sure you copy this url) Username: your CMC registered username Password: your CMC login

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internet of things (IoT) concept art in shape of a lightbulb

Contract R&D

Contract R&D / By

Developing a circuit, device or system? Accelerate your project using CMC Microsystems® technical expertise and global supply chain!​ Augument Your Team with CMC Knowledge and Skills Microelectronics, photonics or MEMS circuit design, simulation, layout, and data preparation for manufacturing VHDL/Verilog, C/C++, OpenCL, MATLAB/Simulink, LabView PDK development Embedded system and FPGA design, GPU programming Linux/Unix system

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Science Foundry Post-Processing for Poly MEMS

Technologies / By

In partnership with Science Foundry, CMC offers users access to the Poly MEMS technology. Poly MEMS technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post-processing for Poly MEMS offers optional HF release and supercritical carbon dioxide

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Science Foundry Poly MEMS Multi-User MEMS Process Technology

Technologies / By

CMC’s multi-project wafer service delivers the MEMS technology, through a partnership with Science Foundry. The Poly MEMS technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.

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Teledyne Micralyne Micralyne MicraGEM-Si™ MEMS Process

Technologies / By

Micralyne MicraGEM-SiTM is a silicon-on-insulator (SOI) based MEMS process which will reduce the initial cost and risk of prototype development, while speeding the time to market for MEMS- Based devices. MicraGEM-SiTM is ideally suited for the manufacture of tilting mirrors and mirror arrays for variable optical attenuators (VOA) and wavelength selective switch (WSS) modules, commonly used in

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AMF Silicon Photonics General-Purpose Fabrication Process

Technologies / By

Silicon-on-insulator, 220-nm top Si film, 3000-nm buried oxide (BOX) High resistivity handle wafer (>750 ohm-cm) 193-nm deep UV lithography for waveguides, enabling features down to approximately 140 nm Two partial etches and one full etch of the top silicon PECVD Silicon Nitride waveguide integration 6 implants for optical modulators (P++, P+, P, N++, N+, N) Germanium

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AMS 0.35 µm CMOS Process Technology (High-Voltage)

Technologies / By

This 0.35 µm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic, Opto and High-Voltage (see details below). The technology is suitable for: High-Voltage Process (H35B4D3) Details Technology Features: 4 metal and 2 poly layers with a

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AMS 0.35 µm CMOS Process Technology (Opto)

Technologies / By

This 0.35 μm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic, Opto (see details below) and High-Voltage. Opto Process (C35B4O1) Details Technology Features: 4 metal and 2 poly layers (similar to basic option) High-efficiency

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AMS 0.35 µm CMOS Process Technology (Basic)

Technologies / By

This 0.35 μm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic (see details below), Opto and High-Voltage. Basic Process (C35B4C3) Details Technology Features: 4 metal and 2 poly layers Supply Voltage: 3.3/5V Bulk-micromachining option, allowing

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TSMC 0.35 µm CMOS Process Technology

Technologies / By

This 0.35 μm CMOS technology is available through CMC’s multi-project wafer service, which delivers Taiwan Semiconductor Manufacturing Company (TSMC) nanometer and micron-scale CMOS technologies. Applications The 0.35 µm CMOS (CMC term is CMOSP35) process is suitable for: Analog circuits RF circuits Mixed-signal circuits Process Details Electrical Contact Forming Technology: Polycide Layers: 4 metal, 2 poly Supply Voltages:

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Synopsys Design Tools

Tools / By

Synopsys provides a comprehensive portfolio of tools for silicon design, synthesis and verification. Software tools available in this bundle include: Custom Design Digital Design Silicon Lifecycle Management Verification For more information, see the Synopsys University Program. For more information about the software available for the current year, contact us at cad@cmc.ca. Licensing Requirements or Restrictions Technical

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SolidWorks Software Packages

Tools / By

SolidWorks Software Packages cover 2D and 3D part modelling, large assembly design, sheet metal and weldments, surfacing, molds, product configuration, and 3D rendering and design analysis for manufacturing and computer-aided manufacturing (CAM). For a full list of the SolidWorks tools available in this package, please refer to the SolidWorks Quick Start Guide. We offer Standard and

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CMC Microsystems, the CMC Microsystems logo, CMC Basecamp, CADpass, Canada’s National Design Network and Réseau National de Conception du Canada, the FABrIC Innovation Network, and the FABrIC logo are trademarks or registered trademarks of Canadian Microelectronics Corporation / Société canadienne de micro-électronique operating as CMC Microsystems.
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